12.07.22听
ESB 001
1:30-4:00 PM
Please join us to learn about the capabilities of the DISCO聽DAD3220 dicing saw in Vanderbilt University鈥檚 VINSE聽cleanroom.聽 Representatives from DISCO will provide an聽overview of dicing applications and techniques.聽Dicing is a standard microfabrication process to create聽custom-sized substrates and devices for a variety of聽electronic, optical, biomedical, and other applications.聽聽Silicon, sapphire, and fused quartz are commonly diced, but聽other materials may be available.
In addition, there will be a tour of the VINSE cleanroom and聽chance to meet the staff for discussion of dicing and other聽projects.